材料简介

Introduction

中间层为 FSTQZ®W 高纯白色不透明石英材料，保留了其出色的隔热性能；两侧为半导体级透明石英材料，高温区使用规避了乳白材料颗粒脱落的风险，稳定性更高；复合层熔融结合，无空穴，具有出色的冷热加工性能，作为隔热和保温材料应用于晶圆制程中。
透明层可根据客户需求定制：FLH321、FLH321H、FLH621、FLH621H、F-HUV等。

The middle layer is FSTQZ®W high purity opaque quartz material, which remains its excellent thermal insulation property.Both sides are semiconductor grade transparent quartz material, which can avoid the risk of opaque material particle falling off at high temperature usage and provide higher stability.The composite layers are fused together and void free, with excellent cold and hot processing properties. It is used as thermal insulation material in wafer fabrication process. The transparent layer can be customized according to customer requirements:FLH321, FLH321H, FLH621, FLH621H, F-HUV, etc.

Al

14.2

Ca

0.60

Mg

0.05

Cu

0.01

Fe

0.23

Ni

0.05

Mn

0.05

Li

0.44

K

0.25

Na

0.12

Zr

—

Ti

1.3

B

0.08

Co

—

总和

17.38